Integrated circuit device having a polyimide moisture barrier coating
AssigneeTexas Instruments Incorporated
InventorsThiam B. Lim, Tadashi Saitoh, Boon Q. Seow
Life of this patent
Estimating the term…
Abstract
A semiconductor package device is disclosed. In one embodiment, attached by its active face to a lead-on-chip leadframe having leadfingers is an integrated circuit. The integrated circuit has a polyimide coating on its backside. An encapsulating material surrounds the integrated circuit and the lead-on-chip leadframe so that the leadfingers are exposed. The polyimide coating on the backside of the integrated circuit helps to reduce package cracking arising from mounting the device to a printed circuit board by relflow solder.
Claims21
A semiconductor integrated circuit adapted for mounting to a leadframe comprising:
- an integrated circuit having an active face and a backside, the active face attached to a leadframe;
- a plastic encapsulant, encapsulating the integrated circuit;
- and
- a polyimide coating on the backside of the integrated circuit between the backside and the encapsulant providing a moisture barrier and to prevent cracking of the encapsulant during mounting to a circuit board.
A semiconductor integrated circuit adapted for mounting to a chip-on-leadframe comprising:
- a plastic encapsulant, encapsulating the integrated circuit;
- and
- an integrated circuit having an active face and a backside, the active face attached to a chip-on-leadframe;
- and
- a polyimide coating on the backside of the integrated circuit between the backside and the encapsulant providing a moisture barrier and to prevent cracking of the encapsulant during mounting to a circuit board.
A semiconductor integrated circuit adapted for mounting to a tabpak tape comprising:
- a plastic encapsulant, encapsulating the integrated circuit;
- and
- an integrated circuit having an active face and a backside, the active face attached to the tabpak tape;
- and
- a polyimide coating on the backside of the integrated circuit between the backside and the encapsulant providing a moisture barrier and to prevent cracking of the encapsulant during mounting to a circuit board.
A semiconductor packaged device comprising:
- a lead-on chip leadframe having leadfingers;
- an integrated circuit having an active face and a backside, the active face attached to the lead-on-chip leadframe;
- a polyimide coating on the backside of the integrated circuit;
- and
- an encapsulating material encapsulating the integrated circuit, part of the leadfingers, and making intimate contact with and adhering to the polyimide coating on the backside of the integrated circuit.
A semiconductor package device comprising:
- a chip-on-lead leadframe having leadfingers;
- an integrated circuit having an active face and a backside, the active face attached to the chip-on-lead leadframe;
- and
- a plastic encapsulant, encapsulating the integrated circuit;
- and
- a polyimide coating on the backside of the integrated circuit between the backside and the encapsulant providing a moisture barrier and to prevent cracking of the encapsulant during mounting to a circuit board.
A semiconductor package device comprising:
- a tabpak tap having lead fingers;
- an integrated circuit having an active face and a backside, the active face attached to the tabpak tape so that the leadfingers are exposed;
- and
- a plastic encapsulant, encapsulating the integrated circuit;
- and
- a polyimide coating on the backside of the integrated circuit between the backside and the encapsulant providing a moisture barrier and to prevent cracking of the encapsulant during mounting to a circuit board.
A semiconductor package device comprising:
- a flip-chip leadframe having leadfingers;
- an integrated circuit having an active face and a backside, the active face attached to the flip-chip leadframe;
- and
- a plastic encapsulant, encapsulating the integrated circuit;
- and
- a polyimide coating on the backside of the integrated circuit between the backside and the encapsulant providing a moisture barrier and to prevent cracking of the encapsulant during mounting to a circuit board.
Dependencies are inferred from the claim text.