Method and apparatus for laser machining
AssigneeFujitsu Limited
InventorYasuo Yamagishi
Life of this patent
Estimating the term…
Abstract
An equipment for excimer laser ablation machining provided a laser (11), a main body (14) housing a mirror (12) for reflecting an ultraviolet ray emitted by the laser and an optical system (13) for arranging the ultraviolet ray to a parallel ray, and a means (15) for moving the relative position of an object to be machined and the parallel ray, the means (15) being a supporter of an object to be machined and having a means (16) for arranging a dielectric mirror mask (7), leaving a space of 0.1 mm through 50 mm, preferably 0.1 mm through 1 mm, between the object to be machined and the dielectric mirror mask (7), the equipment to be employed specifically for producing a via hole of a multi-layered circuit board, and a method for excimer laser ablation machining conducted by employing the foregoing equipment.
Claims15
A laser machining method employing an ultraviolet ray emitted by a laser, comprising:
- optically converting the ultraviolet ray emitted by the laser to a parallel ultraviolet ray, travelling in a first direction;
- supporting an object for selective movement in desired directions in a plane substantially transverse to the first direction and such that an upper surface of the object, to be machined, is maintained substantially in parallel with the plane;
- selectively moving the object in desired directions in the plane thereby to selectively change the position on the surface of the object on which the parallel ultraviolet ray is irradiated;
- and
- supporting a dielectric mirror mask of planar configuration in parallel relationship with respect to the upper surface of the object to be machined and with a space between the upper surface of the object and the lower surface of the planar dielectric mirror mask and such that the dielectric mirror mask remains in a fixed position relative to the upper surface of the object to be machined during selective movement of the object.
An apparatus for laser machining an object, said apparatus comprising:
- a laser for emitting an ultraviolet ray;
- a housing;
- a mirror mounted in the housing for reflecting ultraviolet rays emitted by the laser;
- an optical system for converting the emitted ultraviolet rays into a parallel ultraviolet beam;
- a dielectric mirror mask for patterning the parallel ultraviolet beam;
- and
- a support and traverse mechanism for supporting an object to be machined in the path of the parallel ultraviolet beam during a machining operation,
- said mechanism being operable for moving the object in a direction perpendicular to the beam during a machining operation,
- said mirror mask being supported by said mechanism in a position above the object with a vapor purging space defined between the mask and the object being machined.
Dependencies are inferred from the claim text.