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US 5,312,878 AGranted
Naphthalene containing epoxy resin cured with a dicyclopentadiene phenolic resin
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsToshio Shiobara, Kazutoshi Tomiyoshi, Takayuki Aoki, Hatsuji Shiraishi
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Abstract
A thermosetting resin composition comprising (A) a naphthalene ring-bearing epoxy resin, (B) a dicyclopentadiene-modified phenolic resin, and (C) an inorganic filler is suitable for encapsulating semiconductor devices since the composition cures into a product having a low coefficient of expansion, good adhesion and low moisture absorption.
Claims20
A thermosetting resin composition comprising
- (A) a naphthalene ring-bearing epoxy resin,
- (B) a dicyclopentadiene-modified phenolic resin of the following general formula (1):
- ##STR20## wherein R.sup.1 is a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and letter n is an integer of 0 to 15, and
- (C) an inorganic filler.
1 more element
Dependencies are inferred from the claim text.