Heat dissipator

A heat dissipator for electronic component means of the type having at least one heat transfer surface exposed to a flow of gaseous or liquid cooling medium, said dissipator comprising:

• at least one layer of highly heat conductive material having a contact surface in heat conductive relationship with and connected to at least one of said transfer surfaces for receiving heat from said component means,
• said layer including at least one extension means extending beyond said contact surface disposed in a first plane away from said transfer surface and comprising a louver-like structure for transferring heat between said contact surface and said cooling medium,
• said louver-like structure comprising a multiplicity of substantially parallel fin means defining an axis of orientation parallel to their longitudinal dimension and a central axis for each fin means extending through the center of each, substantially parallel to said axis of orientation,
• said fin means created by subdividing at least one portion of said extension means along substantially parallel lines and by rotating each of said fin means on its central axis into an angular deviation of less than 90 degrees with reference to said first plane, said fin means having two substantially parallel main surfaces on opposed sides, two edge surfaces at a leading and a trailing edge with reference to the flow of said cooling medium, the distance between central axes of adjacent fin means being equal to a width of the main surface of said fin means, the rotation of said fin means opening up gaps in said louver-like structure between main surfaces of adjacent fin means to allow better access to fresh cooling medium flowing through said gaps and exposing said fins means to said flow on both of their main surfaces and at least one edge surface, to increase the engagement of said fin means with said cooling medium for achieving optimum heat transfer between said fin means and said cooling medium.