Plasma processing apparatus using capacitance manometer and pressure control method thereof
AssigneeTokyo Electron Limited
InventorsTakashi Yokota, Osamu Kamikanda
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AssigneeTokyo Electron Limited
InventorsTakashi Yokota, Osamu Kamikanda
Estimating the term…
A pressure gage detects a pressure in a vacuum-processing container as an electrical signal. A pressure detection signal from the pressure gage includes an error over time. An error detecting unit detects a signal representing the error which is output from the pressure gage while the vacuum-processing container is set at a predetermined calibration pressure. A correction value calculating unit calculates, in accordance with the signal representing the error which is detected by the error detecting unit, a signal representing a correction value used in order to cancel the signal representing the error. A correcting unit adds the pressure detection signal from the pressure gage to the signal representing the correction value which is calculated by the correction value calculating unit while an instruction for setting an interior of the vacuum-processing container at a desired pressure value is output, thereby eliminating the error over time which is included in the pressure detection signal. A pressure controlling unit controls the interior of the vacuum-processing container at the desired pressure value in accordance with an output signal from which the error over time has been eliminated by the correcting unit.
A plasma processing apparatus comprising:
A pressure controlling method employing a capacitor manometer, for use in a plasma processing apparatus, wherein said plasma processing apparatus processes an object by use of plasma at a predetermined pressure in a plasma processing container, said capacitance manometer detecting a pressure in said plasma processing container as a pressure detection signal, which includes erroneous components, said method comprising the steps of:
Dependencies are inferred from the claim text.