Printed circuit based for mounted semiconductors and other electronic components

A multi-device semiconductor component, comprising:

• a first substrate having an inside surface and an outside surface;
• first metalization layers on said inside and outside surfaces of said first substrate forming a first electrical interconnection for devices on said outside surface of said first substrate;
• first and second semiconductor devices mounted on said outside surface of said first substrate, each of said devices including a plurality of electrical contacts for establishing electrical communication therewith;
• first electrical interconnection means for connecting said electrical contacts of said first and second devices with said first interconnection to establish electrical communication between said first and second devices and said first interconnection;
• a second substrate having an inside surface and an outside surface;
• second metalization layers on said inside and outside surfaces of said second substrate forming a second electrical interconnection on said outside surface of said second substrate;
• third and fourth semiconductor devices mounted on said outside surface of said second substrate, each of said devices including a plurality of electrical contacts for establishing electrical communication therewith;
• second electrical intercommunication means for connecting said electrical contacts of said third and fourth devices with said second interconnection to establish electrical communication between said third and fourth devices and said second interconnection;
• a lead frame including a plurality of leads each having a proximate end and a distal end, said proximate ends of said leads being arranged in generally opposed pairs in a generally planar configuration and each including an interior portion disposed between and engaged by said inside surfaces of said substrates whereby said leads are fixedly positioned relative to said substrates, and an exterior portion disposed outside of said substrate arrangement for establishing electrical connections to said leads;
• bonding means for securing said substrates on either side of said interior portions of said proximate lead ends;
• and
• connection means for electrically interconnecting said exterior portions of said proximate lead ends with said first and second electrical interconnections whereby said first, second, third, and fourth semiconductor devices are electrically interconnected and electrically accessible through said leads.

A printed circuit board comprising:

• a first substrate;
• a plurality of first electronic circuit devices connected by bonded wires to an array of conductive leads on said first substrate;
• a second substrate;
• a plurality of second electronic circuit devices connected by bonded wires to an array of conductive leads on said second substrate;
• and
• a lead frame connected between said first and second substrates, said lead frame having leads which pass through said first and second substrates and which are connected to said conductive leads.

A printed circuit board for mounting at least one electronic component, the circuit board comprising:

• an assembly, including at least one inner substrate and an outer substrate defining an opening in which the at least one electronic component is mounted and a plurality of plated through holes which are disposed about said opening;
• a plurality of metal members which are electrically independent of one another, each metal member including an external lead, an internal connection portion, and a solder tab, said external lead, internal connection portion and solder tab being unitarily formed, said internal connection portions being disposed between said inner and outer substrates, and said solder tabs protruding into said plated through holes in said outer substrate;
• and
• conductor circuits between said at least one electronic component and said inner and outer substrates, said conductor circuits extending through the opening in said outer substrate to connect with said inner substrate.