Microstrip printed wiring board and a method for making same

A multi-layered printed wiring board comprising:

• a) a first board having an inner layer, and a first and second outer layer, the inner layer being a polytetrafluoroethylene (PTFE) material having a predetermined dielectric constant, the first outer layer having high frequency circuity of a metallic material bonded to a first side of said inner layer, and the second outer layer being a sheet of a metallic material bonded to a second side of said inner layer;
• b) a second board having an inner layer, and a first and second outer layer, the inner layer being a fiberglass material of a first predetermined thickness, the first outer layer of said second board having strips of a metallic material bonded to a first side of said inner layer of the second board, and the second outer layer of said second board being a sheet of a metallic material bonded to a second side of said inner layer of the second board;
• and
• c) a third board, being a fiberglass material of a second predetermined thickness, wherein the strips of said second board form signal lines and transmission lines, the strips being bonded onto the first side of the inner layer of the second board in predetermined locations such that the strips are connected to predetermined high frequency circuity by vias, vias electrically interconnecting predetermined metallic layers, the second outer layer of the first board being laminating to a first side of the third board, and the first outer layer of said second board being laminated to a second side of said third board, thereby forming the multi-layered printed wiring board.

A multi-layered printed wiring board comprising:

• a) a first board having an inner layer, and a first and second outer layer, the inner layer being a polytetrafluoroethylene (PTFE) material having a predetermined dielectric constant, the first outer layer having high frequency circuity of a metallic material bonded to a first side of said inner layer, and the second outer layer being a sheet of a metallic material bonded to a second side of said inner layer;
• b) a second board having an inner layer, and a first and second outer layer, the inner layer being a first dielectric material of a first predetermined thickness, the first outer layer of said second board having strips of a metallic material bonded to a first side of said inner layer of the second board, and the second outer layer of said second board being a sheet of a metallic material bonded to a second side of said inner layer of the second board;
• and
• c) a third board, being a second dielectric material of a second predetermined thickness, wherein said first dielectric material and said second dielectric material are dissimilar from the PTFE material, wherein the strips of said second board form signal lines and transmission lines, the strips being bonded onto the first side of the inner layer of the second board in predetermined locations such that the strips are connected to predetermined high frequency circuity by vias, vias electrically interconnecting predetermined metallic layers, the second outer layer of the first board being laminating to a first side of the third board, and the first outer layer of said second board being laminated to a second side of said third board, thereby forming the multi-layered printed wiring board.

A multi-layered printed wiring board comprising:

• a) a first layer of a metallic material having a geometric configuration to form a microstrip high frequency circuit;
• b) a second layer of a polytetrafluoroethylene (PTFE) material, the first layer being bonded to a first surface of the second layer;
• c) a third layer of a metallic material, wherein the third layer is bonded to a second surface of the second layer thereby forming a ground plane for the microstrip high frequency circuity of the first layer;
• d) a plurality of dielectric layers, each dielectric layer having a predetermined thickness and being of a predetermined dielectric material dissimilar from the PTFE material, and such that a first dielectric layer of the plurality of dielectric layers is bonded to the third layer;
• e) a plurality of metallic layers, wherein predetermined layers of the plurality of metallic layers are configured to form signal lines and transmission lines utilizing stripline techniques, and wherein a first metallic layer of the plurality of metallic layers is bonded to the first dielectric layer of the plurality of dielectric layers, and further wherein dielectric layers of the plurality of dielectric layer are alternately bonded with metallic layers of the plurality of metallic layers thereto, predetermined metallic layers of the plurality of metallic layers and the first and the third layer having predetermined electrical interconnections by vias, thereby forming the multi-layered printed wiring board.

A method for making a multi-layered printed wiring board comprising the steps of:

• a) etching a first side of a first board, such that high frequency circuity results on the first side of the first board, the first board being a polytetraflureothylene (PTFE) material having a metallic sheet bonded to each side of the first board;
• b) etching a first side of a second board, such that strips result in predetermined locations on the first side of the said second board, the second board being a fiberglass material of a predetermined thickness, having a metallic sheet bonded to each side of the second board;
• c) laminating a third board of a fiberglass material, having the same predetermined thickness as the fiberglass material of said second board, to the first board and the third board such that the strips form an internal layer of the multi-layered printed wiring board and the high frequency circuity is an external layer of the multi-layered printed wiring board;
• d) drilling holes in the printed wiring board to form vias for interconnecting predetermined metallic layers;
• and
• e) plating inner walls of the holes drilled with an electrically conducting material thereby interconnecting the predetermined metallic layers.