Method and apparatus for aligning and attaching a surface mount component

A method of increasing and directing surface tension utilized for aligning a leadless surface mount component comprising a termination at each end of the component, the termination having bottom and end portions for attaching to a corresponding pad on a substrate by a reflow process of liquefying and subsequently solidifying a conductive material positioned between the termination and the pad, the method comprising the steps of:

• forming a pad arrangement having a center and comprising two opposite pads positioned on either side of the center, each pad occupying a tri-oval-shaped area comprising:
• an elliptical area having a center substantially centered under the bottom portion of the corresponding termination of the component when the component is aligned with the pad arrangement;
• and
• an arcuate area contiguous with the elliptical area and extending towards the opposite pad in a central lengthwise direction;
• applying the conductive material to the elliptical area;
• and
• thereafter performing the reflow process, whereby the conductive material liquefies and flows onto the arcuate area, losing thickness and thereby increasing the surface tension of the liquefied conductive material.

A pad arrangement for aligning and attaching a leadless surface mount component comprising a termination at each end of the component, the termination having bottom and end portions, the pad arrangement for interconnecting the surface mount component with other circuitry, the pad arrangement comprising:

• a substrate for supporting and interconnecting the surface mount component with the other circuitry;
• and
• two opposite pads formed on the substrate and interconnected with the other circuitry, each pad occupying a tri-oval-shaped area comprising:
• an elliptical area substantially centered under the bottom portion of the corresponding termination of the component when the component is aligned with the pad arrangement;
• and
• an arcuate area contiguous with the elliptical area and extending towards the opposite pad in a central lengthwise direction;
• and
• a conductive material applied to the elliptical area and thereafter reflowed onto the arcuate area, thereby facilitating alignment of the component with the pad arrangement.