Printed substrate for mounting high-power semiconductor chip thereon and driver component making use of the printed substrate

A driver component comprising:

• a printed substrate constructed of a printed interconnected substrate, which is in turn is constructed of an insulating substrate and an interconnected layer formed on at least one principal surface thereof, and a metal plate bonded on another principal surface of the printed interconnected substrate;
• a driving element having a metal-made casing;
• and
• a filler material placed between the metal plate and the metal-made casing of the driving element to fill up a spacing between the metal plate and the casing of the driving element;
• said printed interconnected substrate defining an opening at an area where a semiconductor chip is to be mounted, said opening reaching said metal plate,
• said metal plate covering said opening and having a thickness capable of providing rigidity sufficient to support at least the semiconductor chip to be mounted thereon,
• said metal plate being in close contact with the casing of the driving element, and
• wherein the driving element is a print head.

A driver component comprising:

• a printed substrate constructed of a printed interconnected substrate, which is in turn is constructed of an insulating substrate and an interconnected layer formed on at least one principal surface thereof, and a metal plate bonded on another principal surface of the printed interconnected substrate,
• a driver element having a metal-made casing;
• said metal plate being in close contract with an outer surface of the casing of the driving element;
• and
• a filler material placed between the metal plate and outer surface of the casing of the driver element to fill up a spacing between the metal plate and the outer surface of the casing of the driving element;
• said printed interconnected substrate defining an opening at an area where a semiconductor chip is to be mounted, said opening reaching said metal plate,
• said metal plate covering said opening and having a thickness capable of providing rigidity sufficient to support at least the semiconductor chip to be mounted thereon, and
• wherein the driving element is a print head.