Smart card chip-based electronic circuit
AssigneeSGS-Thomson Microelectronics S.A.
InventorFrancis Steffen
Life of this patent
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Abstract
A portable and connectable chip-based electronic system has one or more chips integrated into a package. The electronic component obtained is mounted, in a first embodiment, on the upper surface of metal contacts. A lower surface has metal contacts that constitute the connector of the system. Each of the metal contacts of the upper face is connected to and faces a metal contact of the lower surface, and vice versa. In a second embodiment, the electronic component is surface mounted on an upper surface of metal contacts, the lower surface of these contacts forming the connector. A system such as this is designed to be inserted into a reader which will get connected to the connector. Such a system may have other electronic components that are mutually interconnected and interconnected with the electronic component.
Claims34
A smart card comprising:
- an insulative support member for supporting an electronic circuit and for rigidifying said card;
- at least one standard semiconductor package supported on a first side of said support member and having a plurality of leads connected thereto, some of said leads being electrically connected to a semiconductor circuit in said semiconductor package, others of said leads providing support for said package but not being electrically connected to said semiconductor circuit;
- first contact areas on a first surface of said insulative member connected to said leads which are electrically connected to a semiconductor circuit and not connected to said other leads providing support;
- and,
- second contact areas on an opposite side of said insulative member in alignment with said first contact areas, said second contact areas being electrically connected to said first contact areas, and being exposed on said second side in a predetermined configuration for contacting electrical contact areas of a card reader;
- at least one of said contact areas being contacted by multiple adjacent ones of said leads.
A smart card comprising:
- a card substrate predominantly comprising an insulating material;
- conductive traces on at least one surface of said substrate;
- a programmable integrated circuit chip having first and second power supply connections, and one or more active signal connections;
- a standard integrated circuit package containing said chip, and having multiple leads at the periphery thereof;
- wherein at least a first one of said leads is affixed to a respective one of said traces and is operatively connected to one of said active signal connections of said chip, and
- wherein at least a second one of said leads is affixed to a respective one of said traces and is NOT operatively connected to any of said active signal connections of said chip, and
- wherein at least a third one of said leads is affixed directly to said substrate.
A smart card comprising:
- a card substrate predominantly comprising an insulating material;
- conductive traces on at least one surface of said substrate;
- a programmable integrated circuit chip having first and second power supply connections, and one or more active signal connections;
- substantially flat standard integrated circuit package containing said chip, and having multiple leads at the periphery thereof;
- wherein each of a first plurality of said leads is affixed to a respective one of said traces and is operatively connected to a respective one of said active signal connections of said chip, and
- wherein each of a second plurality of said leads is affixed to a respective one of said traces and is NOT operatively connected to any of said active signal connections of said chip, and
- wherein each of a third plurality of said leads is affixed directly to said substrate.
A smart card comprising:
- a card substrate predominantly comprising an insulating material;
- conductive traces on at least one surface of said substrate;
- a programmable integrated circuit chip having first and second power supply connections, and one or more active signal connections;
- a standard surface-mount integrated circuit package containing said chip, and having multiple leads at the periphery thereof;
- wherein multiple ones of said traces each have two of said leads affixed thereto;
- and wherein at least one of said leads is affixed directly to said substrate and not to any of said traces.
A smart card comprising:
- a programmable integrated circuit chip having first and second power supply connections, and one or more active signal connections;
- a standard surface-mount integrated circuit package containing said chip, and having multiple leads at the periphery thereof;
- a plurality of metal plates, each having at least tow of said leads affixed thereto, and each having a back surface partially exposed for electrical contact;
- and wherein a plurality of said leads are not affixed to any of said traces.
Dependencies are inferred from the claim text.