Cover for solid-state image sensing device with a concave-shaped cross-section
AssigneeNEC Corporation
InventorKaneyuki Kato
Life of this patent
Estimating the term…
Abstract
A solid-state image sensing element is disposed below and tightly enclosed with an optically transparent cover in order to protect the element from the outside, the cover being integrally formed into an inverse U-shape in a cross-section. The cover is made of plastics having good light transmissivity. The solid-state image sensing element is mounted on a substrate and is electrically connected thereto through metal wires. The above-mentioned transparent cover is adhered on the substrate through an adhesive such as an epoxy resin or the like so that the element is tightly enclosed. Thus, there is provided a solid-state image sensing device which is light in weight and can be fabricated at a low cost.
Claims16
A solid-state image sensing device comprising:
- a substrate;
- a solid-state image sensing element fixed in place on said substrate;
- and
- a cover disposed above said element and having high light transmissivity, said cover comprising a flat top portion and a side-wall portion surrounding said element to provide a concave-shaped cross-section, said side-wall portion being integrally formed with said top portion, said flat top portion having ga length corresponding to at least a width of said image sensing element.
A solid-state image sensing device comprising:
- a substrate;
- a solid-state image sensing element fixed in place on said substrate;
- and
- a cover disposed above said element and having high light transmissivity, said cover being of an H shape in a cross-section and being integrally formed as a whole.
A solid-state image sensing device comprising:
- a substrate comprising a copper-clad glass epoxy laminate with interconnections and an insulating resin layer formed in place on said laminate, a part of said interconnections being disposed under said insulating resin layer;
- a solid-state image sensing element fixed in place on said substrate;
- metal wires for electrically connecting said solid-state image sensing element to said interconnections;
- and
- a cover disposed above said solid-state image sensing element and adhered onto said insulating resin layer, said cover having light transmissivity of about 90% or more, having an inverse U-shaped cross-section with a flat top portion and being provided with a recess having a rectangular parallelpiped-shaped structure, said cover being integrally formed as s whole said recess having a depth of about 0.6 mm or more, and a width of a joint area between said cover and said insulating resin layer being about 1 mm or more.
Dependencies are inferred from the claim text.