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US 5,310,967 AGranted
Applying conductive lines to integrated circuits
AssigneeInternational Business Machines Corporation
InventorsPedro A. Chalco, Matthew F. Cali, Laertis Economikos, James L. Speidell
Life of this patent
Estimating the term…
Abstract
A conductive line is applied to a substrate by aligning the conductive line in juxtaposition with a selected area of the substrate; bonding the conductive line to the substrate; and detaching the conductive line from a carrier in which the conductive line is suspended. The carrier has a carrier opening defined by sidewalls, and conductive material is suspended by the sidewalls of the carrier opening so as to be embedded within the carrier opening, and form the conductive line.
Claims10
A conductive line for applying to a substrate, comprising:
- a carrier having a carrier opening therethrough, said carrier opening defining a conductive line, and said carrier opening being defined by sidewalls;
- and
- conductive material detachably suspended by the sidewalls of the carrier opening, said conductive material having an exposed first surface for applying to a selected area of a substrate, and an exposed second surface, opposite the exposed first surface, for allowing bonding means to be contacted therewith for effectuating bonding of said conductive material to the selected area of the substrate, and said conductive material being detachable from said carrier subsequent to the bonding.
Dependencies are inferred from the claim text.