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US 5,310,965 AGranted
Multi-level wiring structure having an organic interlayer insulating film
AssigneeNEC Corporation
InventorsNaoji Senba, Atsushi Nishizawa
Life of this patent
Estimating the term…
Abstract
To perform a stable wire bonding connecting against a multi-level wiring board using an organic material for the interlayer insulating film, a silicon oxide film and organic interlayer insulating films, for example, polyimide layers, and the first to the fourth level wirings, including a nickel layer by plating are formed on the surface of the silicon substrate as a base in order. By adjusting the thickness of the nickel layer in the wiring, the total Vickers hardness from the substrate to each wiring is adjusted to more than 100, respectively.
Claims24
A multi-level wiring structure, comprising:
- a first level wiring of a laminated structure formed on a main surface of an insulating layer, said first level wiring including a nickel layer and a gold layer, said first level wiring having a first bonding pad portion, a broad width portion, a first strip line portion connecting said first bonding pad portion and said broad width portion and a second strip line portion extending from said broad width portion;
- a polyimide layer successively covering said second strip line portion, said broad width portion, a part of said first strip line portion and said second strip line portion of said first level wiring and said insulating layer except said first bonding pad portion and a remaining part of said first strip line portion of said first level wiring;
- and
- a second level wiring of a laminated structure formed on a main surface of said polyimide layer, said second level wiring including a nickel layer and a gold layer, said second level wiring having a second bonding pad portion and a third strip line portion extending from said second bonding pad portion, said second bonding pad portion of said second level wiring being formed over said broad width portion of said first level wiring with isolation therebetween by said polyimide layer to thereby have a substantially even surface, each of said first and second bonding pad portions being provided as an external-lead-out terminal for said multi-level wiring structure.
1 more element
A multi-level wiring structure, comprising:
- a first level wiring formed on a major surface of an inorganic insulating layer;
- an organic insulating film covering said first level wiring and said inorganic insulating layer, successively;
- and
- a second level wiring having a laminated structure formed on a major surface of said organic insulating film, said second level wiring having a bonding pad at an end portion thereof, said bonding pad been composed of an adhesive metal layer formed on said organic insulating film, a barrier metal layer formed on said adhesive metal layer, a nickel layer formed on said barrier metal layer and a gold layer formed on said nickel layer, said nickel layer being formed between said barrier metal layer and said gold layer with such a thickness that the Vickers hardness of a portion composed of said bonding pad, said inorganic insulating film, said first level wiring and said inorganic insulating film is more than 100.
1 more element
A multi-level wiring structure, comprising:
- a first level wiring having a laminated structure formed on a major surface of a first organic insulating film, said first level wiring having a first bonding pad and a first strip line extending from said first bonding pad;
- a second organic insulating film covering a part of said first strip line of said first level wiring and said first organic insulating film except said first bonding pad and a remaining part of said first strip line of said first level wiring, successively;
- and
- a second level wiring having a laminated structure formed on a major surface of said second organic insulating film, said second level wiring having a second bonding pad and a second strip line extending from said second bonding pad, each of said first and second bonding pads being provided as an external-lead-out terminal for said multi-level wiring structure;
- wherein the Vickers hardness of a first portion composed of said first bonding pad and said first organic insulating film formed thereunder is more than 100 and a second portion composed of said second bonding pad, said second organic insulating film, said first level wiring and said first organic insulating film is more than 100.
2 more elements
Dependencies are inferred from the claim text.