Polyimide materials with improved physico-chemical properties
AssigneeInternational Business Machines Corporation
InventorKrishna G. Sachdev
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Abstract
Copolyamic acids carrying -CF3 group functionalized aromatic segments in the polymer chain derived from aromatic diamines and dianhydrides with linear-rigid-planar structure interrupted by linear-rigid-noncoplanar segments structure and the corresponding copolyimides films are provided. These copolyimides have low in-plane thermal coefficient of expansion, reduced anisotropy in the optical and dielectric properties, low moisture uptake, and improved polyimide-to-polyimide adhesion.
Claims19
A copolyamic acid composition, comprising the following components:
- about 100 mole parts of a combination of a linear aromatic diamine and a linear or non-coplanar aromatic diamine containing a --CF.sub.3 group, said linear or non-coplanar aromatic diamine containing said --CF.sub.3 group comprising 5-30% of said combination and said linear aromatic diamine comprising 70-95% of said combination;
- and
- about 98 to 100 mole parts of a rigid or semi-rigid aromatic dianhydride.
The film of claim 18 having an in-plane refractive index less than that of a BPDA-PDA polyimide film.
Dependencies are inferred from the claim text.