Epoxy resin, maleimide and OH- and epoxy-containing compound
AssigneeKonishi Co., Ltd.
InventorsToshinao Okitsu, Shinichi Sato
Life of this patent
Estimating the term…
Abstract
Disclosed is a heat-resistant resin composition prepared by mixing a resin composition (A) and polyamine (B), followed by heating the mixture for the hardening, said composition (A) being prepared by heating a mixture of (a) polymaleimide resin represented by a general formula: ##STR1## where R.sub.1 is an organic group having a valency of n, Xa and Xb are the same or different monovalent atoms or groups selected from the group consisting of hydrogen atom, halogen atom and organic group, and n is an integer of 1 to 4, (b) an epoxy resin having at least two epoxy groups in the molecule, and (c) a compound having one alcoholic or phenolic OH group and at least one epoxy group in the molecule.
Claims19
A heat-curable two-part heat-resistant resin composition comprising (A) a resin composition as a first part and (B) polyamine hardener as a second part, said composition (A) being prepared by heating a mixture of component (a) maleimide resin represented by a general formula:
- ##STR4## where R' is an organic group having a valency of n, Xa and Xb are the same or different monovalent atoms or groups selected from the group consisting of hydrogen atom, halogen atom and organic group, and n is an integer of 1 to 4, component (b) an epoxy resin having at least two epoxy groups in the molecule and component (c) a compound having one alcoholic or phenolic OH group and at least one epoxy group in the molecule with the proviso that component (b) excludes the compound of component (c), to effect a Michael addition reaction between components (a) and (c).
The heat-resistant resin composition according to claim 17, wherein a mixture of components (a), (b), (c) of composition (A) is heated for 0.5 to 24 hours.
The heat-resistant resin composition according to claim 18, wherein a mixture of components (a), (b), (c) of composition (A) is heated for 1 to 6 hours.
A heat-curable two-part heat-resistant resin composition comprising (A) a resin composition as a first part and (B) polyamine hardener as a second part, said composition (A) being prepared by heating a mixture of component (a) maleimide resin represented by a general formula:
- ##STR6## where R.sup.1 is an organic group having a valency of n, Xa and Xb are the same or different monovalent atoms or groups selected from the group consisting of hydrogen atom, halogen atom and organic group, and n is an integer of 1 to 4, component (b) an epoxy resin having at least two epoxy groups in the molecule and component (c) a compound having one alcoholic or phenolic OH group and at least one epoxy group in the molecule with the proviso that component (b) excludes the compound of component (c), to effect a Michael addition reaction between components (a) and (c), and
- wherein component (b) of epoxy resin contained in composition (A) is at least one material selected from the group consisting of bisphenol A epoxy resin, bisphenol F epoxy resin, novolak epoxy resin, epoxy resin consisting of a glycidylated amine, polyglycidyl ether of polyol, epoxy resin having a heterocyclic ring, aliphatic epoxy resin other than the polyglycidyl ether of polyol and alicyclic epoxy resin.
Dependencies are inferred from the claim text.