Vinyl halide resin with epoxy resin and polyamine
AssigneeMitsui Petrochemical Industries, Ltd.
InventorsToshikazu Furihata, Toru Tomoshige
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Abstract
An adhesive composition for a vinyl halide resin is disclosed. This adhesive composition is formed by incorporating an aliphatic polyamine having a plurality or ether bonds, an alicyclic polyamine or an alkylene diamine into a blend of an epoxy resin and a vinyl chloride copolymer resin. This adhesive composition is effectively used in the solvent-free state for a molded body of a vinyl halide type resin such as a vinyl chloride resin or a vinylidene halide resin.
Claims9
An adhesive composition for a vinyl halide resin, which comprises (a) an epoxy resin, (b) a vinyl chloride copolymer resin and (c) an aliphatic polyamine curing agent component having a plurality of ether bonds, wherein the vinyl chloride copolymer resin (b) is a vinyl chloride/vinyl acetate/vinyl alcohol terpolymer.
A solvent-free adhesive composition for a vinyl halide resin, which comprises (a) an epoxy resin, (b) a vinyl chloride copolymer resin and (c) an aliphatic polyamine curing agent component having a plurality of ether bonds, wherein the vinyl chloride copolymer resin (b) is a vinyl chloride/vinyl acetate/vinyl alcohol terpolymer.
Dependencies are inferred from the claim text.