Method for manufacturing high T.sub.c superconducting circuit elements with metallic substrate
AssigneeInternational Business Machines Corporation
InventorsFrank Litchenberg, Jochen Mannhart, Darrell Schlom
Life of this patent
Estimating the term…
Abstract
A method for manufacturing a high Tc superconducting circuit elements is disclosed, which comprises the steps of preparing a single crystal conductive substrate of Sr.sub.2 RuO.sub.4 by a floating zone melting process; epitaxially growing on the (001)-surface of the Sr.sub.2 RuO.sub.4 substrate a high Tc copper oxide-based superconducting film with a thickness of 1 to 1000 nm; depositing metal pads onto said superconducting film to form electrical contacts; and applying a metal pad to the surface of the substrate to form an electrical contact.
Claims10
A method for manufacturing superconducting circuit elements, comprising:
- weighing and grinding a ratio of strontium carbonate SrCO.sub.3 and ruthenium dioxide RuO.sub.2 to form powder;
- mixing the powder with water and pressing it to form rods;
- sintering the rods in air;
- melting the rods in a floating zone melting process to form a melt.
- Growing crystal materials form the melt having cylindrical shape with layers of strontium ruthenate Sr.sub.2 RuO.sub.4 along the axis of the cylindrical shape;
- cleaving the melt-grown crystal materials of Sr.sub.2 RuO.sub.4 to obtain single-crystal substrates having defined crystallographic surfaces;
- epitaxially growing on at least one (001)-surface of the Sr.sub.2 RuO.sub.4 substrate a film of a high-T.sub.c copper oxide-based superconductor material, the thickness of the superconductor film being in the range of 1 to 1000 nm;
- depositing metal pads onto said superconductor film to form electrical contacts;
- and
- applying a metal pad to the surface of the substrate to form an electrical contact.
Dependencies are inferred from the claim text.