Method of preventing short-circuiting of bonding wires
AssigneeKulicke and Soffa Industries, Inc.
InventorsToshiki Yoshida, Ryuichi Kyomasu, Toshihiro Satoh
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Abstract
A method of preventing the interconnecting fine wires of a bonded semiconductor devices from moving from their preferred loop position after being bonded in an automatic wire bonder includes the step of automatically transferring the bonded semiconductor device to an insulating station prior to other operations. The interconnecting fine wires are coated in a manner which does not disturb or short the interconnecting wire which are pre-cured or cured before being transferred to a storage rack, or directly to a follow-on process step of a continuous production line.
Claims15
A method of preventing bonding wires from shorting against each other after a semiconductor chip is bonded to a carrier and placed in a wire bonding machine, comprising the steps of:
- bonding interconnecting fine wires to pads on the leads on said carrier at a bonding station to provide wire bonded semiconductor device,
- transferring said semiconductor device from said bonding station into an insulating station without disturbing the fine wires,
- coating the outside of said semiconductor device and said interconnecting fine wires with a non-reactive plastic fluid insulating material in a manner which covers all exposed surfaces but does not move the interconnecting wires one against the other,
- removing said coated semiconductor device from said insulating station, and
- promptly curing said non-reactive plastic fluid insulation material sufficient to reinforce the rigidity of said fine wires in a fixed position, thereby electrically insulated one wire from the other during further handing and encapsulation.
Dependencies are inferred from the claim text.