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US 5,310,701 AGranted
Method for fixing semiconductor bodies on a substrate using wires
AssigneeEUPEC Europaeische Gesellschaft fur Leistungshalbleiter mbH
InventorsFranz Kaussen, Martin Figura
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Abstract
A method for mounting semiconductor bodies on a substrate includes bonding ires to a substrate being formed of metal at least in given locations. Semiconductor bodies are laterally fixed to the given locations of the substrate with the wires. The semiconductor bodies are subsequently materially joined to the substrate in the given locations.
Claims6
A method for mounting semiconductor bodies on a substrate, which comprises:
- bonding wires to a substrate being formed of metal at least in given locations;
- laterally fixing semiconductor bodies to the given locations of the substrate with the wires;
- and
- subsequently materially joining the semiconductor bodies to the substrate in the given locations.
1 more element
Dependencies are inferred from the claim text.