Resist compositions comprising a phenolic resin, an acid forming onium salt and a tert-butyl ester or tert-butyl carbonate which is acid-cleavable
AssigneeMicroSi, Inc.
InventorsJames V. Crivello, Michael J. O'Brien, Julia L. Lee
Life of this patent
Estimating the term…
Abstract
A positive photoresist composition is provided which can be used in the presence or absence of atmospheric moisture. There is used a major amount of a commercially available resin, such as a novolak, a dissolution inhibitor with thermally labile t-butyl ether or ester groups, and an aryl onium salt.
Claims12
A positive photoresist photopatternable in the substantial absence of moisture, comprising an admixture of,
- (A) a water or aqueous based soluble phenolic resin other than a resole resin,
- (B) from at least about 10% to up to an equal proportion by weight of (A), of a water or aqueous base insoluble simple compound having a molecular weight of less than 1000 and selected from the group consisting of tertiary butyl esters, aryl tertiary butyl esters and aryl tertiary butyl carbonates, which is a dissolution inhibitor for (A), and
- (C) an aryl onium salt which generates a strong acid having a pKa of less than zero upon being irradiated, in an amount effective to deblock compound (B) when heated,
- where (B) is substituted with acid labile groups which can be deblocked by being heated in the presence of a strong acid, to thereby render (B) soluble in water or aqueous base and ineffective as a dissolution inhibitor for (A).
A positive photoresist photopatternable both in the presence and in the substantial absence of moisture, comprising an admixture of,
- (A) a water or aqueous based soluble phenolic resin other than a resole resin,
- (B) from at least about 10% to up to an equal proportion by weight of (A), of t-butyl cholate which is a dissolution inhibitor for (A), and
- (C) an aryl onium salt which generates a strong acid having a pKa ratio of less than zero upon being irradiated, in an amount effective to deblock compound (B) when heated,
- where (B) can be deblocked by being heated in the presence of a strong acid, to thereby render (B) soluble in water or aqueous base and ineffective as a dissolution inhibitor for (A).
A positive photoresist photopatternable both in the presence and in the substantial absence of moisture, comprising an admixture of,
- (A) a water or aqueous based soluble phenolic resin other than a resole resin,
- (B) from at least about 10% to up to an equal proportion by weight of (A), of t-butyl triformyl cholate which is a dissolution inhibitor for (A), and
- (C) an aryl onium salt which generates a strong acid having a pKa ratio of less than zero upon being irradiated, in an amount effective to deblock compound (B) when heated,
- where (B) can be deblocked by being heated in the presence of a strong acid, to thereby render (B) soluble in water or aqueous base and ineffective as a dissolution inhibitor for (A).
Dependencies are inferred from the claim text.