Enhancement of electromagnetic barrier properties
AssigneeFLEXcon Company, Inc.
InventorsKirit Patel, John R. Pennace
Life of this patent
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Abstract
A method and structure for enhancing electromagnetic barrier properties including a substrate, a metallic layer deposited upon the substrate by vacuum metalization, and a plurality of sets of patterns microembossed upon the surface of the metallic layer for increasing the barrier properties of the structure. The plurality of sets of microembossed patterns each have a line density between about 100 and 50,000 lines per square centimeter.
Claims14
The method of altering the properties of a structure which comprises the steps of:
- (a) providing a substrate,
- (b) applying a surface layer upon said substrate, said surface layer being a metallic coating applied by vacuum metalization, and
- (c) modifying said surface layer by microembossing said surface layer with a plurality of sets of patterns, said plurality of sets of microembossed patterns each having a line density between about 100 and 50,000 lines per square centimeter, in order to increase the barrier properties of said structure.
A method of enhancing the barrier properties of a substrate which comprises the steps of
- (a) applying a surface metallic coating by vaporization and condensation to said substrate;
- and
- (b) modifying the surface of said coating by providing a plurality of sets of microembossed patterns on said coating, said plurality of sets of microembossed patterns having a line density between 100 and 50,000 lines per square centimeter, in order to increase the degree of reflectance of incident electromagnetic energy of falling upon said coating;
- thereby to reduce the penetration of said substrate by the incident electromagnetic energy.
Dependencies are inferred from the claim text.