Circuit system, a composite material for use therein, and a method of making the material
AssigneeTexas Instruments Incorporated
InventorsSunil C. Jha, James A. Forster, Henry F. Breit
Life of this patent
Estimating the term…
Abstract
Discrete powder particles of copper 14 and INVAR 12 are mixed together in a container 16 and packed into a powder metal article. This article is hot vacuum degassed and vacuum sealed and then heated to temperature well below the sintering temperature of copper or INVAR. Immediately after heating the article, it is subjected to a high pressure, high strain force such as extrusion through a die thereby yielding a fully dense, strong composite material 10 with excellent combined thermal expansion and conductivity properties.
Claims13
A method for making a thermal composite material for use in electronic circuit systems comprising:
- a) providing a first powder metal material of a low coefficient of thermal expansion;
- b) providing a second powder metal material of a high thermal conductivity;
- c) mixing said first powder material with said second powder material;
- d) packing said mixture into an article;
- e) heating said article to a temperature below the sintering temperature for either said first powder metal material or said second powder metal material for sufficient time to have uniform temperature throughout the article;
- and
- f) immediately subjecting said heated article to extrusion through a die having an area reduction ratio of at least 8 to 1 so as to impart a true strain to said compacted article of greater than 1.75, thereby yielding a fully dense composite material with excellent combined thermal expansion and conductivity properties.
A method of making a thermal management composite material for use in electronic circuit systems comprising:
- a) providing a first iron-nickel alloy powder metal material of a low coefficient of thermal expansion;
- b) providing a second powder metal material of a high thermal conductivity;
- c) mixing said first and second powder materials to yield a homogeneous mixture;
- d) packing said homogeneous mixture in a container into an article having a porosity of less than 50 percent;
- e) hot vacuum degassing and sealing said article;
- f) heating said article to a temperature below the sintering temperature for either said first powder metal material or said second powder metal material for sufficient time to have uniform temperature throughout the article;
- and
- g) immediately extruding said heated article through a die having a reduction ratio of at least 8 to 1 so as to impart a true strain to said compacted article of greater than 1.75 with an extrusion ram speed of at least 1 foot per minute thereby yielding a fully dense composite material with excellent combined thermal expansion and conductivity properties.
A method of making a thermal management composite material for use in electronic circuit systems comprising:
- a) providing a first iron-nickel alloy powder metal material of a low coefficient of thermal expansion;
- b) providing a second powder metal material of a high thermal conductivity;
- c) mixing said first and second powder materials to yield a homogeneous mixture;
- d) packing said homogeneous mixture in a container into an article having a porosity of less than 50 percent;
- e) hot vacuum degassing and sealing said article;
- f) heating said article to a temperature below the sintering temperature for either said first powder metal material or said second powder metal material for sufficient time to have uniform temperature throughout the article;
- g) immediately extruding said heated article through a die having a reduction ratio of at least 8 to 1 with an extrusion ram speed of at least 1 foot per minute thereby yielding a fully dense composite material with excellent combined thermal expansion and conductivity properties;
- and
- h) preferentially etching the surface of the fully dense composite material to remove only one of the first powder metal material or the second powder metal material thereby yielding a porous surface to enhance bonding characteristics.
A thermal management composite material which is the product of the process comprising the steps of:
- a) providing a first powder metal material of a low coefficient of thermal expansion;
- b) providing a second powder metal material of a high thermal conductivity;
- c) mixing said first powder metal with said second powder metal;
- d) packing said mixture into an article;
- e) heating said article to a temperature below the sintering temperature for either said first powder metal material or said second powder metal material for sufficient time to have uniform temperature throughout the article;
- and
- f) immediately subjecting said heated article to extrusion through a die having an area reduction ratio of at least 8 to 1 so as to impart a true strain to said compacted article of greater than 1.75 thereby yielding a fully dense composite material with excellent combined thermal expansion and conductivity properties.
Dependencies are inferred from the claim text.