Process for bonding a molded article of a thermoplastic saturated norbornene resin
AssigneeNippon Zeon Co., Ltd.
InventorsToshiyasu Matsui, Hidenori Yukishige, Tadao Natsuume
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Abstract
The present invention relates to a process for bonding a molded article of a thermoplastic saturated norbornene resin in which when the molded article is bonded to an adherend widely different from the molded article in coefficient of linear expansion, the adhesion surface of the molded article and that of the adherend are stuck together with an adhesive composed mainly of an epoxy resin which has an elasticity (Shore hardness D: about 40 or less) imparted by modification with a polymer having reactive silyl groups, and then the adhesive is cured. Thus, there is provided such an excellent bonding process that the adhesive strength is hardly deteriorated by a temperature change.
Claims12
A process for bonding a molded article of a thermoplastic saturated norbornene resin which comprises sticking together the adhesion surface of the molded article of a thermoplastic saturated norbornene resin and the adhesion surface of an adherend with an elastic epoxy-silicon based adhesive, and then curing the elastic epoxy-silicon based adhesive.
Dependencies are inferred from the claim text.