Solderable leads
AssigneeNorth American Specialties Corporation
InventorJack Seidler
Life of this patent
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Abstract
A solderable lead structure adapted for joining or soldering to a substrate carrying electrical components, comprising a double comb-like configuration made of conductive material, having two rows of contact strips or leads that are connected to opposite edges of a common carrier strip. At the free or distal ends of the leads, individual clips are formed for resiliently engaging both sides of a substrate. The leads extend from the carrier strip from opposite edges and are then folded to result in a linear, intermeshed arrangement.
Claims26
A solderable lead structure adapted to be attached to a substrate having an array of conductive areas on a surface thereof, said substrate having two opposed surfaces, comprising:
- a main body of conductive material having first and second edges;
- a first set and a second set of leads, said first set extending from said first body edge and said second set extending from said second body edge, each of said leads within said sets having a proximal end attached to said body and a free end extending away from said body, each lead of one set being adjacent a respective lead of the other set;
- and
- clip means formed on each of said leads for resiliently retaining said leads in engagement with said substrate, said clip means for each lead being integral with the free end of said lead, said clip means having two arms, one of said arms being adapted to abut one of said substrate surfaces while the other of said arms is adapted to abut the other surface of said substrate.
A solderable lead structure adapted to be attached to a substrate having an array of conductive areas on a top surface thereof and an array of conductive areas on a bottom surface comprising:
- a main body of conductive material having first and second edges;
- a first set and a second set of leads, said first set extending from said first edge and said second set extending from said second edge, each of said leads within said sets having a proximal end attached to said body and a free end extending away from said body, said first set being adapted to abut said top surface conductive areas and said second set being adapted to abut said bottom conductive areas, each lead of one set being adjacent a respective lead of the other set;
- and
- means for resiliently retaining said substrate, said means for retaining being integral with said free end of said leads.
A solderable lead structure adapted to be attached to a substrate having one or more conductive areas, comprising:
- a main body portion of conductive material having a substantially double comb-like configuration including two rows of substantially parallel elongated leads, each having a lead body with a proximal end and a distal end;
- a common mounting strip having two opposite edges, said leads being attached to said strip at their proximal ends, one of said rows of leads being attached to one of said strip edges;
- said distal ends of said rows of leads being interleaved in a linear arrangement such that said leads are adapted to engage a single edge of the substrate;
- wherein each of said leads comprises means for resiliently retaining said substrate, said means for retaining being integral with said distal ends of said leads.
A method of fabricating a solderable lead structure adapted to be attached to a substrate having two opposed surfaces, with an array of conductive areas on at least one of said surfaces, comprising the steps of
- forming a flat blank having
- a central carrier strip,
- a first set of leads extending outwardly from said central strip in a first direction, and
- a second set of leads extending outwardly from said central strip in an opposite direction,
- the leads of said sets being relatively staggered with respect to one another,
- forming a clip at the end of at least some of said leads, each clip having a pair of generally parallel arms, and
- placing said clips in general alignment.
A flat blank for a lead arrangement adapted to be applied to a substrates having a set of conductive pads extending along a surface thereof, comprising:
- a central carrier strip having two edges,
- a first set of leads extending outwardly from an edge of said central strip generally perpendicularly to said central strip,
- a second set of leads extending outwardly from the other edge of said central strip in the direction opposite from said first set of leads,
- said second set of leads being in staggered relationship with respect to said first set of leads,
- each of said leads having at least one tab extending laterally from each edge thereof, toward an adjoining lead of the same set.
Dependencies are inferred from the claim text.