Card type fuse and method of producing the same
AssigneeSumitomo Wiring Systems, Ltd.
InventorYasuhiko Onishi
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Abstract
A card type fuse aimed at reducing production costs and improving a forming precision of an exothermic fusing portion 2a. The card type fuse comprises an insulation substratum 1, fuse circuits 2 arranged on the insulation substratum 1 and having a narrow exothermic fusing portion 2a, and a cover layer 3 covering fuse circuits 2. The cover layer 3 is made of a heat resisting film. The fuse circuits 2 are printed on the heat resisting film by means of a conductive paste. The insulation substratum 1 is made of a heat resisting thermoplastic resin suitable for an SMT. The insulation substratum 1 is integrally formed on the side having the fuse circuits on the heat resisting film.
Claims11
A method for the production of a card-type fuse comprising at least one fuse circuit on an insulation substrate, said method comprising
- depositing said fuse circuit on a heat resistant film, inserting said heat resistant film into a mold, introducing a heat resistant thermoplastic resin into said mold and in contact with said film and said fuse circuit, and permitting said thermoplastic resin to set, whereby said heat resistant film, said fuse circuit, and said resin are fused together and said film forms a protective cover for said fuse circuit.
Dependencies are inferred from the claim text.