Semiconductor laser with encapsulated lead members

A semiconductor laser device comprising:

• a first lead member having a mounting portion for mounting a semiconductor laser and a photo detecting element for detecting a laser beam radiated from said semiconductor laser;
• at least one second lead member to be connected to said semiconductor laser and said photo detecting element;
• a resin mold member for unitarily molding said first and second lead members, wherein said resin mold member has a recess portion for receiving both said semiconductor laser and said photo detecting element therein and for exposing therein said mounting portion of said first lead member and a part of said second lead member, and wherein both said semiconductor laser and said photo detecting element are mounted on said mounting portion of said first lead member and electrically connected to said second lead member within said recess portion;
• and
• wherein a rear wall of said recess portion of said resin mold body in which said semiconductor laser is disposed to form a taper wall so that a laser beam radiated from a rear end of said semiconductor laser is prevented from being reflected and incident on a resonator of said semiconductor laser as a return beam.

A laser device, comprising:

• a first lead;
• laser means, affixed to said first lead and electrically connected to said first lead, for providing a laser beam;
• at least one second lead located in a first position relative to said first lead, said second lead being electrically connected to said laser means;
• encapsulating means for rigidly encapsulating portions of said first and second leads to maintain said first position of said second lead relative to said first lead, said encapsulating means including an aperture for exposing said laser means thereby enabling said laser means to emit said laser beam through said aperture;
• and
• wherein said encapsulating means includes at least one reference plane indicative of a position of said laser beam relative to said reference plane.

A laser device, comprising:

• a first lead;
• laser means, affixed to said first lead and electrically connected to said first lead, for providing a laser beam;
• at least one second lead located in a first position relative to said first lead, said second lead being electrically connected to said laser means;
• encapsulating means for rigidly encapsulating portions of said first and second leads to maintain said first position of said second lead relative to said first lead, said encapsulating means including an aperture for exposing said laser means thereby enabling said laser means to emit said laser beam through said aperture;
• and
• wherein said aperture includes an angled surface for reflecting said laser beam.

A laser device, comprising:

• a first lead;
• laser means, affixed to said first lead and electrically connected to said first lead, for providing a laser beam;
• at least one second lead located in a first position relative to said first lead, said second lead being electrically connected to said laser means;
• encapsulating means for rigidly encapsulating portions of said first and second leads to maintain said first position of said second lead relative to said first lead, said encapsulating means including an aperture for exposing said laser means thereby enabling said laser means to emit said laser beam through said aperture;
• and
• wherein said first lead includes a transverse member to form a T-shape, said transverse member including opposed ends which are encapsulated by said encapsulating means.