Micro-heatpipe cooled laser diode array

A micro-heatpipe cooled laser diode array assembly comprising:

• (a) a plurality of bodies each said body comprising a single or a plurality of micro-heatpipe(s) each said micro-heatpipe having an elongated closed chamber extending within said body from said first end to said second end within which said chamber is contained a specified amount of a fluid which circulates as vapor in a central vapor space portion of the cross-section of said chamber with said fluid evaporation from said first end and passing to said second end as vapor condensing at said second end and returning to said first end in its liquid phase via one or a plurality of artery chambers each of which is in fluidic communication with said vapor space portion of the cross-section of said chamber thereby forming a closed system for the transfer of the heat of evaporation of said fluid from the said first end to the said second end, micro-heatpipe cooled laser diode array further comprising:
• (b) one or a plurality of laser diode bars being affixed with means providing good thermal contact to the principal surfaces of said bodies at said first end and oriented such that said micro-heatpipe(s) pass in close proximity to said laser diode bars and parallel the their principal plane;
• (c) multiple said assemblies being held with a mechanical mounting means in a stacking manner such that said bodies each containing one or multiple said micro-heal pipes pass between adjacent said assemblies, whereby two-phase heat transfer is effected from the volume located between adjacent said laser diode bars;
• (d) each said assembly provided with electrical means for providing electrical energy to said laser diode bars.

A micro-heatpipe cooled laser diode array assembly wherein said micro-he atpipes pass between said laser diodes for cooling, said assembly comprising:

• (a) plurality of bodies each containing single or multiple micro-heatpipe means for heat transfer;
• (b) assemblies each of which comprises one or more linear laser diode array bars affixed with means providing good thermal contact to the principal surfaces of said bodies;
• (c) multiple said assemblies held with a mechanical mounting means in a stacking manner by passing said assemblies through the wall of a sealed enclosure containing a specified amount of fluid and a capillary means for returning said fluid from all parts of said enclosure to said multiple assemblies;
• whereby said fluid is evaporated at multiple said assemblies with resulting vapor phase of said fluid passing to other parts of said enclosure and condensing with released heat being passed through said enclosure walls to the exterior and the condensed liquid phase of said fluid being returned to said assemblies by capillary action for re-evaporation.
• (d) multiple said assemblies provided with electrical means for providing electrical energy to said assemblies.

A micro-heatpipe cooled laser diode array assembly wherein said micro-heatpipes pass between said laser diodes for cooling, said assembly comprising:

• (a) plurality of bodies each containing single or multiple micro-heatpipe means for heat transfer;
• (b) assemblies each of which comprises one or more linear laser diode array bars affixed with means providing good thermal contact to the principal surfaces of said bodies;
• (c) mechanical mounting means of said multiple assemblies are provided by passing said assemblies through the wall of an enclosure with an entrance and an exit with means for passing a dielectric fluid through said enclosure and over said multiple assemblies, wherein said assemblies are cooled by convection or boiling;
• (d) multiple said assemblies provided with electrical means for providing electrical energy to said assemblies.

A micro-heatpipe cooled laser diode array comprising:

• (a) a plurality of assemblies each said assembly comprising a body with a first end and a second end with each said assembly further comprising single or multiple laser diode bars attached to said first end of said body with a mechanical means having good thermal conductivity;
• (b) each said body further comprising a single or a plurality of micro-heatpipe(s) each said micro-heatpipe having an elongated closed chamber extending within said body from said first end to said second end within which said chamber is contained a specified amount of a fluid which circulates as vapor in a central vapor space portion of the cross-section of said chamber with said fluid evaporation from said first end and passing to said second end as vapor condensing at said second end and returning to said first end in its liquid phase via one or a plurality of artery chambers each of which is in fluidic communication with said vapor space portion of the cross-section of said chamber thereby forming a closed system for the transfer of the heat of evaporation of said fluid from the said first end to the said second end;
• (c) multiple said assemblies being held in a two dimensional close packed arrangement with the principal axis of each said assembly parallel with the principal axis of every other said assembly and with all said first ends grouped together and all said second ends grouped together;
• (d) each said assembly being provided with electrical means for providing electrical energy to said assemblies.