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US 5,309,326 AGranted
Circuit module having stacked circuit boards
AssigneeRohm Co., Ltd.
InventorHirai Minoru
Life of this patent
Estimating the term…
Abstract
A circuit module has a first circuit board, an IC chip mounted on the first circuit board, an electrode of the IC chip being connected to a wiring pattern of the first circuit board by a metal wire and the IC chip and the metal wire being coated with resin, and a second circuit board on which at least one unit of the first circuit board and the IC chip is mounted. The first circuit board is a double-side wired circuit board and the second circuit board is a single-side wired circuit board.
Claims2
A circuit module comprising:
- a first circuit board, a semiconductor element mounted on the first circuit board, an electrode of said semiconductor element being connected to a wiring pattern of said first circuit board by a metal wire, and a resin coating on said semiconductor element and said metal wire;
- and
- a second circuit board having a larger area than the first circuit board, on which the first circuit board is mounted in stacked relation, wherein said first circuit board is a double-side wired circuit board and said second circuit board is a single-side wired circuit board.
Dependencies are inferred from the claim text.