Device for interconnecting integrated circuit packages to circuit boards

An electronic subassembly comprising:

• an integrated circuit (IC) package, said IC package comprising a land grid array package, said land grid array package having an array of contacts on one surface thereof surrounding a contact free area, at least one of said contacts being a first contact, said first contact being receptive to a first voltage level, at least one other of said contacts being a second contact, said second contact being receptive to a second voltage level;
• circuit board means having a plurality of pads, an array of which corresponds to said array of contacts of said land grid array package, at least one of said pads being a first pad, said at least one first pad corresponding to said at least one first contact, said first pad being electrically connected to at least one second pad and having said first voltage level thereon, at least one other of said pads being a third pad, said at least one third pad corresponding to said at least one second contact, said third pad being electrically connected to at least one fourth pad and having said second voltage level thereon, said second and fourth pads being disposed at an area on said circuit board means corresponding to said contact free area of said land grid array package;
• first compressible connector means sandwiched between said IC package and said circuit board means, said connector means electrically and mechanically interconnecting said IC package to said circuit board means, said first compressible connector means including an opening therethrough, said opening being disposed under said contact free area of said IC package;
• and
• a decoupling capacitor disposed in said opening and connected to said circuit board means, said decoupling capacitor providing decoupling capacitance between said first and second voltage levels on said land grid array package, said decoupling capacitor being in communication with said second and fourth pads on said circuit board means.