Thermally conductive screen mesh for encapsulated integrated circuit packages
AssigneeMicroelectronics and Computer Technology Corporation
InventorsMichael A. Olla, Thomas P. Dolbear, Seyed H. Hashemi
Life of this patent
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Abstract
An encapsulated integrated circuit package having an integrated circuit chip with a plurality of electrical leads connected thereto and at least one thermally conductive screen mesh positioned adjacent to the chip. A non-electrically conductive thermosetting or thermoplastic material forms a housing enclosing the chip and bonded to the screen mesh. Preferably one of the layers is exposed to the outside of the housing and the screen mesh is secured to a substrate supporting the chip.
Claims31
An encapsulated integrated circuit package, comprising:
- an electronic component;
- a plurality of layers of thermally conductive screen mesh positioned adjacent to the component;
- a non-electrically conductive thermosetting or thermoplastic material forming a housing enclosing the component and bonded to the screen mesh;
- and
- a plurality of electrical leads electrically connected to the component and sealably extending through the housing.
An encapsulated integrated circuit package, comprising:
- an electronic component wherein said component is an integrated circuit chip;
- a substrate within the package supporting the chip;
- a first thermally conductive screen mesh positioned adjacent to the component;
- a second thermally conductive screen mesh positioned adjacent to the substrate on the side opposite the chip;
- a non-electrically conductive thermosetting or thermoplastic material forming a housing enclosing the component and bonded to the screen mesh;
- and
- a plurality of electrical leads electrically connected to the component and sealably extending through the housing.
An encapsulated integrated circuit package, comprising:
- an integrated circuit chip;
- a substrate supporting the chip;
- a thermally conductive flexible wire screen mesh positioned adjacent to the chip;
- a non-electrically conductive thermosetting or thermoplastic material forming a housing which moldably encapsulates the chip and the substrate wherein the screen mesh is molded into the housing but at least some of the screen mesh is exposed to the outside of the housing;
- and
- a plurality of electrical leads electrically connected to the chip and sealably extending through the housing.
An encapsulated integrated circuit package, comprising:
- an electronic component;
- a thermally conductive flexible wire screen mesh positioned adjacent to the component;
- a plurality of mechanical fasteners wherein said fasteners are nuts and bolts securing only the outer edge of the screen mesh to the component;
- a non-electrically conductive thermosetting or thermoplastic material forming a housing enclosing the component and bonded to the screen mesh;
- and
- a plurality of electrical leads electrically connected to the component and sealably extending through the housing.
Dependencies are inferred from the claim text.