Multiple-layer microstrip assembly with inter-layer connections

A multiple-layer assembly adapted for transitioning electrical signals between analogous surfaces of two layers thereof, comprising:

• a plurality of layers, each having a top surface and a bottom surface separated by an edge surface, wherein the top surface is substantially parallel to the bottom surface;
• first top circuitry disposed on a first top surface of a first layer of said plurality of layers;
• first bottom circuitry disposed on a first bottom surface of said first layer;
• connecting means, mounted on said first layer, for electrically connecting said first top circuitry to said first bottom circuitry;
• second top circuitry disposed on a second top surface of a second layer of said plurality of layers;
• and
• adhesive binding means, operatively engaged to each of said first layer and said second layer, to hold said first layer and said second layer so that said second top surface is located between said first bottom surface and said second bottom surface and so that said first bottom circuitry is located sufficiently adjacent, overlapping and spaced from said second top circuitry, with a dielectric material therebetween, to form a capacitive electrical connection therebetween, thereby forming an electrical connection between said first top circuitry disposed on the first top surface of said first layer and said second top circuitry disposed on the second top surface of said second layer.

A multiple-layer microstrip assembly adapted for transitioning electrical signals between analogous surfaces of two layers thereof, comprising:

• (a) a plurality of layers, each having a top surface and a bottom surface separated by an edge surface, wherein the top surface is substantially parallel to the bottom surface, and the edge surface is substantially perpendicular to each of the top and bottom surfaces;
• (b) first top circuitry disposed on a first top surface of a first layer of said plurality of layers;
• (c) first bottom circuitry disposed on a first bottom surface of said first layer;
• (d) connecting means, mounted on said first layer, for electrically connecting said first top circuitry to said first bottom circuitry;
• (e) second top circuitry disposed on a second top surface of a second layer of said plurality of layers;
• and
• (f) binding means, engaged to each of said first layer and said second layer, to hold said first bottom circuitry sufficiently adjacent and overlapping said second top circuitry to form an electrical connection therebetween, thereby forming an electrical connection between said first top circuitry disposed on the first top surface of said first layer and said second top circuitry disposed on the second top surface of said second layer, wherein a surface area of said first top circuitry does not overlap with a combined surface area of said first bottom circuitry and said second top circuitry;
• wherein said second layer comprises a microstrip transmission line including:
• a dielectric substrate layer forming top, bottom, and edge surfaces of said second layer;
• a ground plane disposed on the second bottom surface of said second layer;
• and
• a signal conductor disposed on the second top surface of said second layer, wherein said signal conductor and said ground plane are separated by said dielectric substrate layer.

A multiple-layer microstrip assembly adapted for transitioning electrical signals between analogous surfaces of two layers thereof, comprising:

• (a) a plurality of layers, each having a top surface and a bottom surface separated by an edge surface, wherein the top surface is substantially parallel to the bottom surface, and the edge surface is substantially perpendicular to each of the top and bottom surfaces;
• (b) first top circuitry disposed on a first top surface of a first layer of said plurality of layers;
• (c) first bottom circuitry disposed on a first bottom surface of said first layer;
• (d) connecting means, mounted on said first layer, for electrically connecting said first top circuitry to said first bottom circuitry;
• (e) second top circuitry disposed on a second top surface of a second layer of said plurality of layers;
• and
• (f) binding means, engaged to each of said first layer and said second layer, to hold said first bottom circuitry sufficiently adjacent and overlapping said second top circuitry to form an electrical connection therebetween, thereby forming an electrical connection between said first top circuitry disposed on the first top surface of said first layer and said second top circuitry disposed on the second top surface of said second layer, wherein a surface area of said first top circuitry does not overlap with a combined surface area of said first bottom circuitry and said second top circuitry;
• wherein said first bottom circuitry and said second top circuitry have substantially equal widths, and one of said first bottom circuitry and said second top circuitry has a terminal end defining a stub having an arbitrary width and a length substantially equal to one-half of a wavelength, wherein said stub and the other of said first bottom circuitry and second top circuitry are arranged to form a one-quarter wavelength overlap region.

A multiple layer assembly forming a branch-line quadrature hybrid that can be used to transition signals between analogous surfaces of two layers of said multiple-layer assembly comprising:

• a plurality of layers, each having a top surface and a bottom surface separated by an edge surface, wherein the top surface is substantially parallel to the bottom surface;
• first bottom circuitry disposed on a first bottom surface of a first layer of said plurality of layers;
• second top circuitry disposed on a second top surface of a second layer of said plurality of layers, said top circuitry includes a closed loop conductive path;
• binding means, engaged to each of said first layer and said second layer, for holding at least a portion of said first bottom circuitry sufficiently adjacent and overlapping at least a portion of said second top circuitry to form an electrical connection therebetween, wherein a branch-line quadrature hybrid is formed by a combination of said bottom circuitry, said closed loop conductive path of said second top circuitry, and the overlap therebetween.

A multi-layer microstrip assembly adapted for transitioning electrical signals between analogous surfaces of two layers thereof, comprising:

• a first layer that has a first top surface and a first bottom surface that is separated from said first top surface;
• first circuitry that includes first top circuitry which is located on said first top surface, first bottom circuitry which is located on said first bottom surface, and first interconnect circuitry which connects said first top circuitry and said first bottom circuitry;
• a second layer that includes a second top surface and a second bottom surface which is separated from said second top surface;
• second circuitry that includes second top circuitry that is located on said second top surface;
• said first layer and said second layer positioned so that said second top surface is located between said first bottom surface and said second bottom surface;
• and
• a ground plane underlying at least said first top circuitry and said second top circuitry;
• wherein said first top circuitry and said first bottom circuitry are located so that said first top circuitry is laterally displaced from said first bottom circuitry and there is substantially no overlap therebetween relative to said ground plane;
• wherein said first bottom circuitry and said second top circuitry are located so that said first bottom circuitry overlaps said second top circuitry relative to said ground plane to form an overlap region and electrically connect said first bottom circuitry and said second top circuitry, thereby electrically connecting said first top circuitry and said second top circuitry;
• wherein said first top circuitry and said second top circuitry are located so that there is substantially no overlap between said first top circuitry and said second top circuitry relative to said ground plane;
• wherein substantially only dielectric material is located between first top circuitry and said ground plane and between said second top circuitry and said ground plane.

A method for constructing a multiple-layer assembly adapted to transition electrical signals between analogous surfaces of two layers thereof, comprising the steps of:

• first providing a first layer that includes a first substrate with a first top surface and a first bottom surface that is separated from said first top surface, and first circuitry that includes first top circuitry located on said first top surface, first bottom circuitry that is located on said first bottom surface, and interconnect circuitry extending between said first top circuitry and said first bottom circuitry;
• second providing a second layer that includes a second substrate with a second top surface and a second bottom surface that is separated from said second top surface, and second circuitry that includes second top circuitry that is located on said second top surface;
• and
• bonding, using an adhesive, said first layer to said second layer so that said second top surface is between said first bottom surface and said second bottom surface and so that said first bottom circuitry overlaps said second top circuitry to form an overlap region and to capacitively electrically connect said first bottom circuitry and said second top circuit, thereby electrically connecting said second top circuitry to said first top circuitry.

A method for constructing a multiple-layer microstrip assembly adapted to transition electrical signals between analogous surfaces of two layers thereof, comprising the steps of:

• first providing a first layer that includes a first substrate with a first top surface and a first bottom surface that is separated from said first top surface, and first circuitry that includes first top circuitry located on said first top surface, first bottom circuitry that is located on said first bottom surface, and interconnect circuitry extending between said first top circuitry and said first bottom circuitry, said first top circuitry laterally offset from said first bottom circuitry;
• second providing a second layer that includes a second substrate with a second top surface and a second bottom surface that is separated from said second top surface, and second circuitry that includes second top circuitry that is located on said second top surface;
• and
• positioning said first layer and said second layer with respect to one another so that said first bottom circuitry and said second top circuitry lie outside a vertical region between said first top circuitry and said second layer, and said first bottom circuitry and said second top circuitry form an electrical connection to electrically connect said second top circuitry to said first top circuitry;
• said step of positioning includes binding said first layer to said second layer so that said first bottom circuitry and said second top circuitry are capacitively coupled.