Encapsulated semiconductor package having protectant circular insulators
AssigneeMotorola, Inc.
InventorJames P. Letterman, Jr.
Life of this patent
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AssigneeMotorola, Inc.
InventorJames P. Letterman, Jr.
Estimating the term…
The present invention includes a semiconductor package (20) that has a leadframe (10). An insulator (13) is mounted on a surface of a flag (11) of the leadframe (10) to insulate a portion of the leadframe (10) from the external environment. A semiconductor die (16) is also mounted on the flag (11), spaced away from the insulator (13). A portion of the leadframe (10), the semiconductor die (16), and a portion of the insulator (13) are encapsulated by a body (21) of the package (20). The body (21) also has an alignment hole (23) that extends from a surface of the body to the insulator (13), and exposes a portion of a surface of the insulator (13). In addition, the body (21) overlaps the insulator (13) and forms a seal to the insulator (13) protecting the leadframe (10) from the external environment.
An insulated semiconductor package comprising:
A semiconductor package comprising:
An encapsulated semiconductor package comprising:
Dependencies are inferred from the claim text.