US 5,309,024 AGranted

Multilayer package

AssigneeKabushiki Kaisha Toshiba

InventorNaohiko Hirano

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Abstract

The present invention provides a multilayer ceramic package, which comprises a conductive layer, formed like a square layer, applying a power voltage V.sub.DD or a ground voltage V.sub.SS to a semiconductor device, and having a square hole in its central portion, a plurality of inner leads connected to the conductive layer at the inner portion of the conductive layer, and a plurality of outer leads connected to the conductive layer at the outer portion of the conductive layer, wherein if a first contact point between the inner lead and the conductive layer, a second contact point between the outer lead and conductive layer, a distance between adjacent two first contact points is C.sub.1, a distance between adjacent two second contact points is C.sub.2, a shortest distance from the first contact point to the second contact point is h, both C.sub.1 /h and C.sub.2 /h are 3/8 or less.

Claims21

Dependent claims

A multilayer package, comprising:

a semiconductor device;
a conductive layer applying a power voltage V.sub.DD or a ground voltage V.sub.SS to said semiconductor device;
a plurality of inner leads having one end connected to said conductive layer at the inner portion of said conductive layer and other end connected to said semiconductor device;
and
a plurality of outer leads having one end connected to said conductive layer at the outer portion of said conductive layer, wherein a first contact point between said conductive layer and each inner lead and a second contact point between said conductive layer and each outer lead are arranged to satisfy at least the following relationship:
both (C.sub.1 /h) and (C.sub.2 /h) are (3/8) or less where a distance between nearest neighboring two first contact points is C.sub.1 and a distance between nearest neighboring two second contact points is C.sub.2, and the shortest distance from the first contact point to the second contact point is h.

3 more elements

Dependencies are inferred from the claim text.