Semiconductor device having particular power distribution interconnection arrangement

A semiconductor device comprising;

• a semiconductor chip having a main surface and a plurality of electrodes on the main surface;
• electrical connection means including a plurality of electrically conductive connections disposed around the semiconductor chip electrically connecting respective electrodes of the semiconductor chip for receiving external signals including I/O signals, a power supply voltage, and a grounding voltage;
• power supply/grounding voltage connection means including at least one metal post on one of the conductive connections for conducting one of a power supply voltage and a grounding voltage, the metal post being electrically connected at one end to one of the conductive connections close to the semiconductor chip and extending nearly perpendicular to the conductive connection;
• at least one common plane conductor for the power supply voltage and a common plane conductor for the grounding voltage extending over and parallel to the plurality of electrically conductive connections to which the plurality of electrically conductive connections for one of the power supply voltage and the grounding voltage are commonly connected;
• and
• a molding resin encapsulating the semiconductor chip, part of the electrical connection means, and part of the power supply/grounding voltage connection means, part of the metal post being exposed outside the molding resin.