Semiconductor integrated circuit device having terminal members provided between semiconductor element and leads

A semiconductor integrated circuit device comprising:

• an integrated circuit chip having pads;
• a lead frame stage having first and second areas, the integrated circuit chip being mounted on the first area;
• a plurality of terminal members mounted on a second area of the lead frame stage, the terminal members respectively having electrically conductive patterns and being made of a material identical to a material of which the integrated circuit chip is made, a first of the terminal members comprising a first number of electrically conductive patterns, and a second of the terminal members comprising a second number of electrically conductive patterns different from the first number of electrically conductive patterns;
• inner leads spaced apart from the lead frame stage;
• a first group of bonding members connecting the pads of the integrated circuit chip and the electrically conductive patterns of the terminal members to each other;
• and
• a second group of bonding members connecting the electrically conductive patterns of the terminal members and the inner leads to each other.

A semiconductor integrated circuit device comprising:

• an integrated circuit chip having pads;
• a lead frame stage;
• a terminal member mounted on the lead frame stage, the terminal member having an upper surface with first and second areas said integrated circuit chip being mounted on the first area of the upper surface of the terminal member, said terminal member being made of a material identical to a material of which the integrated circuit chip is made;
• electrically conductive patterns formed on the second area of the upper surface of the terminal member;
• inner leads spaced apart from the lead frame stage;
• a first group of bonding members connecting the pads of said integrated circuit chip and the electrically conductive patterns of the terminal member to each other;
• and
• a second group of bonding members connecting the electrically conductive patterns of the terminal member and the inner leads to each other.