Soldering interconnects for selective line coupling

A structure for selectively coupling adjacent interconnect lines disposed on a printed circuit board to one another, comprising:

• a first copper arcuate pad structure coupled to one of the adjacent interconnect lines;
• a second copper elongated pad structure coupled to another one of the adjacent interconnect lines, said second pad structure extending inside the arc described by said first pad structure and being spaced therefrom by a distance of approximately 0.25 mm to both prevent spiking and promote solder bridging therebetween;
• a solder-phobic material disposed on said adjacent interconnect lines, said solder-phobic material having an aperture therethrough that defines a total wetting surface that includes said first and second pad structures;
• and
• a solder fillet of a height of at least 0.20 mm formed within said aperture through said solder-phobic material and on said total wetting surface, said total wetting surface having a given area and said solder fillet having sidewalls that form a dihedral angle of at least 75.degree. with respect to upper surfaces of said first copper arcuate pad member and said second copper elongated pad structure such that said fillet bridges between said first and second pad structures without flowing outside said aperture in said solder-phobic material.