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US 5,308,927 AGranted
Wiring board and a method of manufacturing
AssigneeSumitomo Electric Industries, Ltd.
InventorNorihiro Hosoi
Life of this patent
Estimating the term…
Abstract
A wiring board, which can be efficiency produced and has excellent heat resistance, and a method of manufacturing the same. With ion-irradiation, a conductive layer and a metal layer are formed in an insulating substrate. In the vicinity of the interface between the insulating substrate and the metal layer, a composition region, which includes the atoms of the insulating substrate and the metal layer, is formed by applying ions to a metal layer formed in the insulating substrate.
Claims12
A wiring board, comprising:
- an insulating substrate;
- and
- a circuit pattern layered on a surface of said insulating substrate, said circuit pattern including a conductive layer and a mixed layer, said mixed layer being disposed on said conductive layer, a conductivity of said conductive layer being higher than that of said insulating substrate, and said mixed layer including a mixture of metal atoms and insulating substrate atoms and having a conductivity higher than that of said conductive layer.
A wiring board, comprising:
- an insulating substrate;
- a circuit pattern, said circuit pattern including a metal layer located on a surface of said insulating substrate;
- and
- an interface region located between said metal layer and said insulating substrate, said interface region having metal atoms from said metal layer and atoms from said insulating substrate.
1 more element
Dependencies are inferred from the claim text.