Device for forming solder connections
AssigneeRaychem Corporation
InventorAlain Lamome
Life of this patent
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Abstract
A device for forming a solder connection between a plurality of electrical conductors, comprises a hollow, dimensionally heat-recoverable sleeve 1 formed for example from polyvinylidine fluoride, the sleeve having one end that is open to allow the insertion of the electrical conductors therein, and another end that is closed by a substantially spherical sealing insert.
Claims9
A device for forming a solder connection between a plurality of electrical conductors, which comprises a hollow, dimensionally heat-recoverable sleeve that contains a quantity of solder, the sleeve having a first end portion that is open to allow insertion of one or more electrical conductors and a second end portion that contains, and is closed by, a substantially spherical sealing insert.
Dependencies are inferred from the claim text.