Cure inhibited epoxy resin compositions and laminates prepared from the compositions

Abstract

In summary, the invention is related to the discovery of a class of compounds which inhibits the reaction of a polyepoxide with a curing agent at low temperatures. More particularly the invention relates to an epoxy resin composition comprising a) a polyepoxide; and b) a cure inhibitor comprising boric acid or maleic acid. In another embodiment, the invention comprises an epoxy resin composition comprising a) a polyepoxide; b) a cure inhibitor comprising boric acid or maleic acid, c) a curing agent without phenolic hydroxyl moieties, and d) optionally a catalyst for the reaction of the polyepoxide with the curing agent. In still another embodiment the invention relates to a composition useful for curing a polyepoxide which comprises a) a curing agent capable of reacting with a polyepoxide at elevated temperatures; and b) an inhibiting amount of boric acid or maleic acid; and optionally c) a catalytic amount of a catalyst useful for accelerating the reaction of a polyepoxide with the curing agent.

Dependencies are inferred from the claim text.