Alignment check pattern for multi-level interconnection

An alignment check pattern used for a multi-level interconnection having a first level wiring formed on a major surface of a first insulating film, a second insulating film formed to cover said major surface of said first insulating film and a surface of said first level wiring, a second level wiring formed on a surface of said second insulating film, a third insulating film formed to cover a surface of said second insulating film and a surface of said second level wiring, a third level wiring formed on a surface of said third insulating film, and a fourth insulating film formed to cover a surface of said third insulating film and a surface of said third level wiring, said alignment check pattern comprising:

• a first dummy pattern formed between said first and said second insulating films, and substantially has the same thickness as said first level wiring;
• a second dummy pattern formed between said second and said third insulating films, and positioned directly over said first dummy pattern, and substantially has the same thickness as said second level wiring;
• a regular scale pattern formed between said third and said fourth insulating films, and positioned directly over said second dummy pattern, and substantially has the same thickness as said third level wiring;
• and
• a vernier scale pattern formed on a surface of said fourth insulating film and positioned directly over said regular scale pattern.

An alignment check pattern comprising:

• a first insulating film;
• a plurality of dummy patterns formed on a surface of said first insulating film;
• a second insulating film formed on a composite surface of said first insulating film and said plurality of dummy patterns;
• a regular scale pattern formed on a surface of said second insulating film to cross said plurality of dummy patterns in isolation therefrom by said second insulating film;
• a third insulating film formed on a composite surface of said second insulating film and said regular scale pattern;
• and
• a vernier scale pattern formed on a surface of said third insulating film positioned directly over said regular scale pattern.

An alignment check pattern comprising:

• a first insulating film;
• a first dummy pattern formed on a surface of said first insulating film;
• a second insulating film formed on a composite surface of said first insulating film and said first dummy pattern;
• a second dummy pattern formed on said second film, and positioned directly over said first dummy pattern in plan view;
• a third insulating film formed on a composite surface of said second insulating film and said second dummy pattern;
• a regular scale pattern formed on said third insulating film, and positioned directly over said second dummy pattern;
• fourth insulating film formed on a composite surface of said third insulating film and said regular scale pattern;
• and
• a vernier scale pattern formed on a surface of said fourth insulating film and positioned directly over said regular scale pattern.