Method and apparatus for through hole substrate printing
AssigneeDelco Electronics Corporation
InventorsJoseph M. Zachman, Donald E. Eagle, Sherri L. Bernhard, Michael G. Coady, Jeffery P. Somers
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AssigneeDelco Electronics Corporation
InventorsJoseph M. Zachman, Donald E. Eagle, Sherri L. Bernhard, Michael G. Coady, Jeffery P. Somers
Estimating the term…
Disclosed is an apparatus and method of through hole substrate printing wherein the apparatus includes a nest plate having a plurality of vacuum source holes formed therein of a size substantially greater than the through holes in the substrate, and a plurality of removable pointed pins supporting the substrate in a substantially flat and horizontal position during the printing operation. The removably pointed pins allow for the flexibility of printing a variety of conductive patterns for different substrates and without the risk of breaking the substrate or smearing the conductive pattern on the bottom surface of the substrate or the subsequent substrate to be printed.
A combination comprising a non-conductive substrate and an apparatus for applying conductive material to the non-conductive substrate having first and second opposed surfaces, perimeter portions, and an interior portion having through holes extending between the first and second surfaces, and wherein the apparatus comprising:
A combination comprising:
A method of printing conductive ink on a first and second substrate having different through hole designs from each other comprising:
An apparatus for applying conductive ink to a substrate having first and second opposed surfaces, perimeter portions, and an interior portion having through holes extending between the first and second surfaces, said apparatus comprising:
Dependencies are inferred from the claim text.