Method for manufacturing a printed wiring board having a shield layer
AssigneeNippon CMK Corp.
InventorsShin Kawakami, Satoshi Haruyama, Hirotaka Okonogi
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Abstract
The method for manufacturing the printed wiring board having a shield layer of the present invention is characterized in that, in a method for manufacturing a printed wiring board wherein a printed wiring circuit is provided on one or both sides of an insulating board and a shield layer is provided on the printed wiring circuit through an insulating layer, a shield layer and an earth circuit are formed on the insulating layer while injecting under pressure a coating for shield from a filling nozzle through a mask.
Claims1
In a method for manufacturing a printed wiring board having a printed wiring circuit provided on one or both sides of an insulating board and a shield layer provided on the printed wiring circuit through an insulating layer, the steps of:
- forming a shield layer and an earth circuit by injecting a shield coating material under pressure on said insulating layer through a mask from a nozzle;
- and removing excess shield coating material from the printed wiring board by a squeegee attached to the nozzle.
Dependencies are inferred from the claim text.