Method of preparing modified polyphenylene oxide resin systems for electrical laminates having improved solderability and solvent resistance

Abstract

Broadly, the present invention comprises a solventless process wherein blends of thermoset polyphenylene oxide and triallylcyanurates can be processed into fiber reinforced laminates, and especially laminates prepared by the Wiggins Teape process. One aspect of the present inventive process comprises blending the polyphenylene powder with a liquid epoxy material, optionally with flame retardants and catalysts, preferably in a high shear mixer at elevated temperature, e.g. in the range of about 100.degree.-130.degree. C. The resultant upstaged or partially-cured blend is sufficiently solidified to be granulated into a powder for Wiggins Teape processing or, optionally, conventional press processing into a fiber reinforced laminates. Resin systems thus-prepared exhibit both improved solderability resistance and improved resistance to organic solvents when compared to thermoplastic systems.

Dependencies are inferred from the claim text.