Method of making semiconductor heterostructures of gallium arsenide on germanium
AssigneeAT&T Bell Laboratories
InventorsEugene A. Fitzgerald, Jr., Jenn-Ming Kuo, Paul J. Silverman, Ya-Hong Xie
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AssigneeAT&T Bell Laboratories
InventorsEugene A. Fitzgerald, Jr., Jenn-Ming Kuo, Paul J. Silverman, Ya-Hong Xie
Estimating the term…
The invention is predicated upon the discovery by applicants that exposure of a Ge surface to arsenic produces a drastic change in the step structure of the Ge surface. Subsequent exposure to Ga and growth of GaAs produces three-dimensional growth and a high threading dislocation density at the GaAs/Ge interface. However exposure of the Ge surface to Ga does not substantially change the Ge step structure, and subsequent growth of GaAs is two-dimensional with little increase in threading dislocation density. Thus a high quality semiconductor heterostructure of gallium arsenide on germanium can be made by exposing a germanium surface in an environment substantially free of arsenic, depositing a layer of gallium on the surface and then growing a layer of gallium arsenide. The improved method can be employed to make a variety of optoelectronic devices such as light-emitting diodes.
An improved method of making semiconductor heterostructure of gallium arsenide on germanium comprising the steps of:
Dependencies are inferred from the claim text.