Laternal field emmission devices and methods of fabrication

A method of fabricating a field emission device, said method comprising the steps of:

• (a) disposing a first metallic layer relative to the upper surface of a substrate, said first metallic layer being disposed so as to extend parallel to the upper surface of said substrate and have a thickness of only several hundred angstroms;
• (b) overlying a first insulating layer on said first metallic layer;
• (c) providing an opening through said first metallic layer and said first insulating layer disposed thereon;
• (d) disposing a conformal layer of material only on the walls of said said opening provided in step (c), said conformal layer being of predetermined thickness;
• (e) filling said opening at least partially with a second metallic layer such that said conformal layer spaces said second metallic layer from said first metallic layer, said predetermined conformal layer thickness equaling a desired spatial distance between said first and second metallic layers;
• and
• (f) providing means for applying an electrical bias voltage to said first metallic layer and to said second metallic layer, said bias voltage to be applied being sufficient to cause cold cathode emission of electrons from said first metallic layer to said second metallic layer.