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US 5,308,429 AGranted
System for bonding a heatsink to a semiconductor chip package
AssigneeDigital Equipment Corporation
InventorSusan J. Bradley
Life of this patent
Estimating the term…
Abstract
A method and apparatus for bonding a heatsink to a semiconductor chip package using localized pressure and conducted heat. A thermally conductive adhesive film is positioned between the heatsink and the package. A heated copper slug is positioned on top of the heatsink. Heat conducted from the slug and through the heatsink to the adhesive melts and cures the adhesive under a constant pressure supplied by the dead weight of the slug to create a bond-line having a desired thickness.
Claims5
A method for bonding a heatsink to a semiconductor chip package, comprising the steps of:
- mounting a semiconductor chip package including a heat removal surface on a printed circuit board;
- positioning a thermally conductive heat curable adhesive on said heat removal surface;
- positioning a heatsink on said thermally conductive heat curable adhesive;
- selecting a thermally conductive slug having a predetermined weight;
- placing said thermally conductive slug on said heatsink to melt, flow, and cure said thermally conductive heat curable adhesive by using heat supplied by said slug and pressure supplied by the weight of said slug.
2 more elements
A method for bonding a heat sink to a component:
- placing a heat curable adhesive on an electrical component mounted on a surface of a printed circuit board;
- positioning a heatsink on said heat curable adhesive;
- selecting a slug having a predetermined weight and a predetermined temperature;
- placing said slug on said heatsink for a predetermined time to cure said heat curable adhesive by heat supplied by said plug and pressure supplied by the weight of said slug.
1 more element
Dependencies are inferred from the claim text.