Method and apparatus for optimizing bond tool pressure distribution
AssigneeMotorola, Inc.
InventorsJames K. Heckman, Mark C. Hoggatt
Life of this patent
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Abstract
Bond tool pressure distribution is optimized by a method and apparatus having a device having a first surface which permits inclination of the first surface in at least one direction, wherein the device is in a locked position. A first bonding arrangement is positioned on the first surface of the device. A second surface makes contact to the first bonding arrangement. This contact is detected and the device is unlocked to allow the first surface to incline while the second surface is in contact with the first bonding arrangement. The second surface is applied to the first bonding arrangement with a force, and the device is locked upon application of the force.
Claims13
A method of optimizing a bond tool pressure distribution, comprising the steps of:
- providing a device having a first surface which permits inclination of the first surface in at least one direction, wherein the device is in a locked position;
- providing a first bonding arrangement having at least a portion positioned on the first surface of the device;
- providing a second surface and contacting the second surface to the first bonding arrangement;
- unlocking the device to allow the first surface to incline upon contact of the second surface to the first bonding arrangement;
- applying the second surface to the first bonding arrangement with a bonding force;
- and
- locking the device upon application of the bonding force.
A method of optimizing a bonding tool pressure distribution, comprising the steps of:
- providing a gimbal having a first surface in a locked position;
- providing a first bonding arrangement having at least a portion positioned on the first surface of the gimbal;
- providing a bonding tool and contacting the bonding tool to the first bonding arrangement;
- automatically detecting an initial contact of the bonding tool to the first bonding arrangement;
- unlocking the gimbal to allow the first surface of the gimbal to incline upon the initial contact of the bonding tool to the first bonding arrangement;
- applying the bonding tool to the first bonding arrangement with a maximum force;
- and
- locking the gimbal when the maximum force is applied.
An apparatus, comprising:
- a device having a first surface which permits inclination of the first surface in at least one direction;
- a second surface capable of contacting a first bonding arrangement positioned on the first surface of the device;
- a means for determining when the second surface makes contact with the first bonding arrangement coupled to the device, wherein the means for determining when the second surface makes contact with the first bonding arrangement is comprised of a circuit;
- and
- a means for locking and unlocking the first surface coupled to the device which cooperates with the means for determining when the second surface makes contact with the first bonding arrangement.
An apparatus, comprising:
- a device having a first surface which permits inclination of the first surface in at least one direction;
- a second surface capable of contacting a first bonding arrangement positioned on the first surface of the device;
- a means for determining when the second surface makes contact with the first bonding arrangement coupled to the device, wherein the means for determining when the second surface makes contact with the first bonding arrangement is comprised of a laser;
- and
- a means for locking and unlocking the first surface coupled to the device which cooperates with the means for determining when the second surface makes contact with the first bonding arrangement.
An apparatus, comprising:
- a device having a first surface which permits inclination of the first surface in at least one direction;
- a second surface capable of contacting a first bonding arrangement positioned on the first surface of the device;
- a means for determining when the second surface makes contact with the first bonding arrangement coupled to the device, wherein the means for determining when the second surface makes contact with the first bonding arrangement is comprised of a micrometer;
- and
- a means for locking and unlocking the first surface coupled to the device which cooperates with the means for determining when the second surface makes contact with the first bonding arrangement.
Dependencies are inferred from the claim text.