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US 5,307,980 AGranted
Solder pad configuration for wave soldering
AssigneeFord Motor Company
InventorThomas D. Belanger, Jr.
Life of this patent
Estimating the term…
Abstract
A printed circuit board is provided with a solder pad configuration for wave soldering a surface mount device with its longitudinal axis in a direction perpendicular to the solder wave. A leading solder pad is not wider than the surface mount device. A trailing solder pad is wider than the surface mount device, thereby ensuring that the trailing pad is sufficiently wet by the solder wave.
Claims3
A printed circuit board assembly comprising:
- a printed circuit board;
- a surface mount device having a first end and second end wave soldered to said printed circuit board;
- a first solder pad deposited on said printed circuit board having a width not greater than the width of said first end;
- and
- a second solder pad deposited on said printed circuit board having a width greater than the width of said second end;
- said first pad and said second pad oriented so that said first end is wave soldered to said first pad before said second end is wave soldered to said second pad.
3 more elements
Dependencies are inferred from the claim text.