Lead arrangement for integrated circuits and method of assembly
AssigneeNorth American Specialties Corporation
InventorJack Seidler
Life of this patent
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Abstract
A lead arrangement is provided having a number of leads to be mechanically and electrically connected to a substrate. Retaining means are also provided integral with the lead arrangement to hold the substrate against the leads, as during soldering. The retaining means may be disengaged from the substrate separately or simultaneously with the trimming of the leads from the lead arrangement after connecting to the substrate.
Claims25
A lead arrangement for connecting one or more leads to a circuit substrate, comprising:
- a supporting strip;
- one or more conductive electrical leads, each having first and second ends, each of said leads having its first end joined integrally with said strip and extending transversely from one edge of said strip;
- and
- means joined to said strip along the opposite edge of said strip for resiliently urging said substrate against and in contact with the second ends of said leads.
A lead arrangement for connecting one or more leads to a circuit substrate, comprising:
- a supporting strip;
- one or more conductive electrical leads, each having first and second ends, each of said leads having its first end joined integrally with said strip;
- and
- means joined to said strip for resiliently retaining said substrate in contact with the second ends of said leads;
- wherein said retaining means comprises at least one retaining arm extending from said strip in a direction away from said leads, and
- wherein said retaining arms are adapted to be folded over said substrate to hold said substrate in relation to said leads;
- and
- wherein a portion of at least one of said retaining arms when folded is adjacent the first end of at least one of said leads, such that said strip and retaining arms may be severed simultaneously from said leads.
A method for simultaneously connecting a plurality of leads to a circuit substrate, comprising the steps of:
- providing a strip of resilient conductive material having a plurality of leads extending therefrom from one edge, each of said leads being connected to said strip at a first end and having a free second end, said substrate having conductive areas at positions corresponding to said free second lead ends;
- forming means on said strip extending outwardly of said strip from one edge thereof opposite said one edge for holding said substrate to said leads;
- providing solder on either said second lead ends or said conductive areas;
- positioning said substrate on said strop such that said conductive surfaces are juxtaposed respectively to said second ends with solder therebetween;
- and
- thereafter engaging said retaining means to resiliently hold said substrate in said position.
A method for simultaneously connecting a plurality of leads to a circuit substrate, comprising the steps of:
- providing a strip of resilient conductive material having a plurality of leads extending therefrom, each of said leads being connected to said strip at a first end and having a free second end, said substrate having conductive areas at positions corresponding to said free second lead ends;
- forming means on said strip extending outwardly of said strip for holding said substrate to said leads;
- providing solder on either said second lead ends or said conductive areas;
- positioning said substrate on said strip such that said conductive surfaces are juxtaposed respectively to said second ends with solder therebetween;
- engaging said retaining means to resiliently hold said substrate in said position;
- forming said retaining means as individual arms integral with said strip;
- and
- folding said arms over said substrate.
A method of manufacturing a lead arrangement, comprising the steps of:
- forming at least one lead integral with a strip of resilient conductive material and extending transversely of said strip from one edge of said strip, said leads corresponding to at least one conductive area of a substrate;
- forming retaining means integral with said strip and extending transversely of said strip from the other edge of said strip oppositely to said leads, said retaining means being adapted to retain said substrate in contact with said leads when said substrate engages said leads and said retaining means is folded over said substrate.
A method of joining a substrate to a lead arrangement, wherein said arrangement has a strip of resilient conductive material with one or more leads extending transversely from one edge of said strip, each said lead corresponding to a respective conductive area on said substrate, said strip also having integral therewith means extending transversely from the other edge of thereof oppositely from said leads from retaining said substrate on said leads, comprising the steps of:
- placing said substrate on said leads, with solder between each said conductive area and a respective lead;
- engaging said retaining means over said substrate to hold each said lead resiliently in juxtaposition to its respective conductive area;
- applying heat to melt said solder at a workstation;
- moving said substrate and lead arrangement out of said workstation before cooling to permit insertion of another substrate and lead arrangement into said workstation;
- and
- allowing said substrate and lead arrangement to cool away from said work station.
A blank for a lead arrangement for a substrate having at least one conductive area, comprising
- a strip of conductive resilient material,
- at least one lead extending transversely from said strip, each said lead having a proximal end joined integrally to said strip and also having a distal end,
- a retaining arm extending transversely from said strip oppositely to at least one of said leads, said arm having a proximal end integral with said strip and also having a distal end,
- said arm being adapted to be bent to a position wherein said arm distal end is adjacent to said lead distal end with a gap therebetween sufficient to accommodate said substrate therein, so that the substrate's conductive area may be juxtaposed to a respective lead distal end.
Dependencies are inferred from the claim text.