Method of providing a capacitor within a semiconductor device package

Method of forming a semiconductor device assembly comprising:

• mounting a semiconductor device to a die attach pad, wherein the die attach pad is generally coplanar with a plurality of leads extending generally radially in a plane from the semiconductor device, wherein a pair of the leads are power leads;
• providing a plastic film layer having two opposing surfaces atop the leads, wherein the semiconductor device extends above one surface of the plastic film layer and the leads are disposed on the opposite surface of the plastic film layer;
• forming a pad as a portion of the plastic film layer, the pad being disposed atop the pair of power leads;
• providing cutouts extending through the pad in alignment with the pair of power leads;
• and
• disposing a capacitor atop the pad on a surface of the plastic film layer opposite the leads, the capacitor having two conductive legs, both of which are connected through the cutouts to the pair of power leads.

Method of forming a semiconductor device assembly comprising:

• providing an upper plastic film layer;
• providing a lower plastic film layer;
• sandwiching metallic leads between the upper and lower plastic film layers;
• supporting a die attach pad between the upper and lower plastic film layers;
• mounting a semiconductor chip to the die attach pad;
• connecting the semiconductor chip to the leads;
• and
• disposing a capacitor on a surface of the upper plastic film layer, opposite the leads, the capacitor having two conductive legs connected to two of the leads.